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The Difference between OJ and GPP Chips
Jul 04, 2018

The products of the OJ structure are glued to protect the junction and then solidify at about 200 degrees. Protect the P-N junction to get the voltage.

The product of the GPP structure, the P-N junction of the chip is under the protection of the passivated glass. The glass is the glass powder which is sintered at about 800 degrees, and the glass layer is formed after cooling. The glass layer and chip are fused into one and can not be separated by mechanical means. The protective glue of OJ is only covered on the surface of P-N junction.

Due to the difference of structure, when there is external stress (such as bending angle treatment), the device performs cold and heat shock, if the plastic package has air leakage, and so on. OJ products, if their protective glue and silicon wafer are not firmly integrated, there will be a case of poor protection, resulting in a certain failure rate of the device. GPP products do not have a similar situation.

The reliability of the GPP diode is high. First, the leakage of the GPP at normal temperature is smaller than that of the OJ. It is particularly important that HTRB (high temperature reverse bias is the most important parameter for measuring product reliability) GPP is much better, and OJ products can only bear about 100 degrees of HTRB. GPP still performed very well when the temperature reached 150 degrees.